| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayered wiring board where a solder bump coating the bonding pad of itself and the solder bump coating the electrode of an electronic part are abutted accurately on each other and the electrode of the electronic part can be electrically connected accurately to the specified bonding pad. SOLUTION: This board is constituted by stacking organic resin insulating layers 2 and film wiring conductor layers 3 alternately and also, electrically connecting the film wiring conductor layer 3 positioned above and below with each other through a through hole conductor 9 provided in the organic resin insulating layer 2a, and this is also constituted by providing itself with a bonding pad 11 which electrically connects with the film wiring conductor layer 3 and to which an outside electronic part A is connected, at the internal face of the hole 10 provided in the uppermost organic resin insulating layer 2a. In this case, the bonding pad 11 is coated with a solder bump 12 which has a cavity 12a at the apex.</p> |
