| 发明名称 |
A PACKAGE MOLDING APPARATUS |
| 摘要 |
An improved mold for forming a semiconductor package, having a molding compound injection gate having a height not greater than the thickness of the lead frame of the semiconductor assembly placed in the mold.
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| 申请公布号 |
KR0151828(B1) |
申请公布日期 |
1998.12.01 |
| 申请号 |
KR19950022122 |
申请日期 |
1995.07.25 |
| 申请人 |
SAMSUNG ELECTRONICS CO.,LTD |
发明人 |
NOH, HEE-SUN;CHOE, HEE-KOOK;CHO, INN-SIK;PAKR, TAE-SUNG |
| 分类号 |
B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 |
主分类号 |
B29C45/26 |
| 代理机构 |
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代理人 |
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