发明名称 Laser machining apparatus and method of controlling same
摘要 A laser machining apparatus according to the present invention describes characteristics of a laser oscillator with a function including laser power, pulse frequency and duty ratio, computes a command for a power supply unit in a feed forward control section according to a command based on the function and on the power, duty ratio and frequency, computes a command for a power supply unit in the feedback control section from a power command value and a power measurement value from the power sensor, and inputs these command to the power supply unit. Also the laser machining apparatus detects changes in characteristics in the laser oscillator and corrects the function for characteristics of the laser oscillator.
申请公布号 US5841096(A) 申请公布日期 1998.11.24
申请号 US19970928226 申请日期 1997.09.12
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 TAKAHASHI, TEIJI;IMAI, YOSHIHITO;MORITA, ATSUSHI;MATSUBARA, MASATO;NAGANO, OSAMU;FUKUSHIMA, TSUKASA
分类号 B23K26/00;B23K26/42;H01S3/00;H01S3/097;H01S3/102;H01S3/104;H01S3/131;H01S3/134;(IPC1-7):B23K26/00 主分类号 B23K26/00
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