| 摘要 |
A connecting device, and corresponding method, for connecting a semiconductor chip/chip and a conductor, the connecting device including: a pad formed on the chip; a passivation layer formed around the pad thereby defining an aperture in the passivation layer; a pad-to-bump connecting layer at least in the aperture; and a bump, formed on the pad-to-bump connecting layer, not extending laterally outside of the aperture. The passivation layer is also formed on an edge area of the pad so as to define shoulder portions between which the aperture is located. The pad-to-bump connecting layer includes: a first base layer formed in the aperture and also on the shoulder portions of the passivation layer so that the first base layer extends laterally outside the aperture; and a second base layer formed at least in the aperture. The cross-sectional area of the bump is less than the cross-sectional area of the aperture.
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