| 摘要 |
PROBLEM TO BE SOLVED: To protect a gold alloy wire against disconnection, even if a semiconductor device is exposed to an environment of severe heat cycles by a method, wherein the gold alloy wire is formed of material composed of a prescribed amount of Ag, a prescribed amount of an element selected out of Pd and Pt, a prescribed amount of an element selected from among Y, La, Ru, Ir, Eu, Yb, Gd, and Be, and gold and unavoidable impuritiess as the rest. SOLUTION: A prescribed amount of Ag, a prescribed amount of an element selected from among Pd and Pt, a prescribed amount of an element selected out of Y, La, Ru, Ir, Eu, Yb, Gd, and Be are added to high-purity gold of purity 99.999 wt%, which are melted in a vacuum melting furnace and then cast into a gold alloy ingot. The gold alloy ingot is subjected to cold working by the use of a fluted roll and a wire drawing machine and then undergoes both intermediate and final annealing, whereby a gold alloy wire is manufactured. By this setup, even if a semiconductor device provided with a copper alloy lead frame is exposed to an environment of severe heat cycles, a gold alloy wire of this constitution can be protected against disconnection. |
