| 摘要 |
PROBLEM TO BE SOLVED: To obtain a good adhesion to a resin and improve the reliability of a semiconductor package, by specifying the surface roughness and its substitute value in a specified range, using a three-dimensional surface roughness analyzer. SOLUTION: An Fe alloy material contg. Ni 35-45 wt.%, Fe and inevitable impurities is rolled to have a rough surface by die rolls at a final cold or temper rolling. An electron beam three-dimensional roughness analyzer is used to enlarge the surface 1000 times and specifies the arithmetic means roughness Ra in a range of 0.05-0.8μm, based on the enlarged surface, and the surface area substitution defined as (measured sample surface area)/(area of the measuring range) is in a range of 1.005-1.08.
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