| 摘要 |
PROBLEM TO BE SOLVED: To increase efficiency of surface mounting of photosensors and simplify by a method wherein a multiple of recesses, which respectively have a two- step step, for mounting photosensor elements and linear through holes, which are arranged in the vicinities of the recesses, are coupled with each other by plated circuits. SOLUTION: A plastic is molded into such a shape that it has deep recesses 10 for mounting photosensor elements, shallow recesses 11 for wire-bonding and through holes 12, which are arranged in the vicinities of the recesses 11, to obtain a plastic molding 13. Plated circuits 14 are respectively formed crossing these recesses 10 and 11 and the holes 12, whereby a plastic circuit molding is obtained. The circuits 14 are respectively obtained by forming an electroless plating in the holes 12 and the recesses 11. The photosensor elements 15 are die-bonded to the recesses 10 and the elements 15 are wire-bonded to the circuits 14 to connect the elements 15 with the circuits 14.
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