<p>Disclosed is a heat-sensitive stencil sheet having its perforating and separating properties in the case of doing stencil-making by thermal heads and not allowing a releasing layer thereof to transfer to the other stencil sheet even in the case of stacking the heat-sensitive sheet to each other. The heat-sensitive stencil sheet comprises a porous substrate, a thermoplastic resin film laminated thereon with an adhesive, and a releasing layer provided on the thermoplastic resin film, wherein the releasing layer mainly consists of silicone phosphate.</p>
申请公布号
DE69504121(D1)
申请公布日期
1998.09.24
申请号
DE1995604121
申请日期
1995.04.12
申请人
RISO KAGAKU CORP., TOKIO/TOKYO, JP
发明人
WATANABE, HIDEO, MINATO-KU, TOKYO, JP;OKUDA, SADANAO, MINATO-KU, TOKYO, JP