发明名称 |
Semiconductor device having a heat sink with bumpers for protecting outer leads |
摘要 |
A QFP adapted to lowering the heat resistance and increasing the number of pins includes a heat-radiating metal plate having bumpers formed at the four corners thereof as a unitary structure, a semiconductor chip mounted on the heat-radiating metal plate, leads provided on the heat-radiating metal plate and surrounding the peripheries of the semiconductor chip, bonding wires for connecting the leads to the semiconductor chip, and a sealing resin member for sealing part of the semiconductor chip, inner leads of the leads, bonding wires and part of the heat-radiating metal plate. The tips of the bumpers integrally formed with the heat-radiating metal plate are positioned outside the tips of the outer leads that are protruding from the sealing resin member. In the QFP producing method, the heat-radiating metal plate having the bumpers and the lead frame having the leads are secured outside the sealing resin member.
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申请公布号 |
US5808359(A) |
申请公布日期 |
1998.09.15 |
申请号 |
US19950547774 |
申请日期 |
1995.10.25 |
申请人 |
HITACHI, LTD;HITACHI TOHBU SEMICONDUCTOR, LTD. |
发明人 |
MUTO, KUNIHARU;NISHIKIZAWA, ATSUSHI;TSUCHIYA, JYUNICHI;HATA, TOSHIYUKI;KOIKE, NOBUYA;SHIMIZU, ICHIO |
分类号 |
H01L23/28;H01L21/44;H01L21/48;H01L21/50;H01L21/56;H01L21/60;H01L23/02;H01L23/29;H01L23/433;H01L23/495;(IPC1-7):H01L23/36;H01L23/50;H01L23/34 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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