| 摘要 |
A dip coating method and apparatus whereby the thickness of a thin resist layer is more uniformly formed, and the system is cheaper in cost. The conveying system includes a circulative conveying portions which convey gripping devices for respectively gripping very much thinner base plates with the upper portions thereof being gripped, and further includes work conveying portions.The works ascend and descend on a certain vertical plane. The mechanical system of dipping process portion E is mechanically and physically independent of the works conveying portion before and behind the dipping process portion, thereby the works silently ascend and descend with the result that the thickness of a resist layer is uniformly formed. The velocity of the ascending plate is lowered. |
