发明名称 |
SOLDER-HOLDING CLIPS FOR APPLYING SOLDER TO CONNECTORS |
摘要 |
<p>An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.</p> |
申请公布号 |
EP0860033(A1) |
申请公布日期 |
1998.08.26 |
申请号 |
EP19960937899 |
申请日期 |
1996.11.01 |
申请人 |
NORTH AMERICAN SPECIALTIES CORP. |
发明人 |
CACHINA, JOSEPH;SEIDLER, JACK;ZANOLLI, JAMES, R. |
分类号 |
B23K35/02;H01R4/02;H01R43/02;H01R43/16;H05K3/34;(IPC1-7):H01R9/09 |
主分类号 |
B23K35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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