APPARATUS FOR INSPECTING PACKAGED COMPONENT

摘要

PROBLEM TO BE SOLVED: To highly accurately detect the position of an electronic component free from the influence of a thickness and packaging density in inspecting packaged components. SOLUTION: An image of an electronic component packaged on a substrate is picked up by an image input means 104 and stored in an image memory 105. A scanning angle detecting means 106 detects edges of the electronic component from a plurality of profiles for an inspection region to obtain an approximate position and inclination, and detects edges from a plurality of slantly horizontal and vertical profiles according to the inclination. A horizontal edge detecting means 107 and a vertical edge detecting means 108 for detecting a combination of rising and falling edges corresponding to a component size as a pair of horizontal and vertical edges are used to calculate a position and inclination of the electronic component from the obtained pair. A component position determination means 109 for comparing the calculated position and inclination with a preset reference position from a reference data storage means 110 for determination is provided, thereby enabling highly accurate and highly reliable inspection free from the influence of a thickness of the electronic component or packaging density.