| 摘要 |
In a semiconductor apparatus, a first circuit (3) provided on a major surface of a semiconductor substrate. The first circuit includes a plurality of logic circuits (51...5n) of an identical structure, the logic circuits having input terminals supplied with identical signals. First metal wiring (30) is provided on the semiconductor substrate in a direction identical to a direction of arrangement of the logic circuits, the first metal wiring being connected to one of the input terminals of each of the logic circuits. A second circuit (6) provided on the major surface of the semiconductor substrate in an outside area which does not overlap an area extending in a direction perpendicular to the direction of arrangement of the logic circuits, the second circuit supplying an identical signal to the input terminals of the logic circuits of the first circuit. A second metal wiring (40) is connected between an output terminal of the second circuit and a substantially middle point of the first metal wiring. The second metal wiring has a portion situated in parallel to the logic circuits. Thereby, an influence of wiring delay due to a difference in distances among the logic circuits can be reduced and a high-speed operation is achieved. <IMAGE> |
