| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a small-sized highly reliable semiconductor package by preventing the cracking of the package. SOLUTION: After openings 3 and through holes 9 are formed through polyimide bonding sheet 1 and copper foil is stuck to the sheet 1, inner connecting sections and expansion wiring 2 are formed. After die bond films 4 are temporarily bonded to the semiconductor chip mounting areas of a supporting substrate, semiconductor chips 6 are bonded to the semiconductor chip mounting areas. Clearances are formed between the chips 6 and films 4 in areas where no wiring exists and chips 6 are electrically connected to the wiring 2 by bonding gold wires 5 to the chip 6 and wiring 2. Then semiconductor packages are formed by sealing the chips 6, films 4, and wiring 2 with a semiconductor sealing epoxy resin 7 and melting solder balls positioned to the openings 3, and then, separating each package from another with a punch. The semiconductor package thus obtained is mounted on an external substrate 10 by using IR reflow. The films 4 relieve internal pressures which are produced in the clearance section, because the films 4 are deformed or broken on the through holes 9 sides. |
