| 摘要 |
PROBLEM TO BE SOLVED: To prevent the cost from increasing by forming a fluorescent layer on the wafer and enabling the increase of man-hour required for forming the fluorescent layer to be substantially ignored. SOLUTION: A light emitting diode 1 is manufactured by forming a chip 2 as a one-face terminal type chip provided with positive and negative electrodes on one face, adhesively forming a fluorescent layer 3 on the light emitting face in a film-shape when the chip 2 is at the stage of wafer, and by cutting the wafer into individual chips 2. Since the fluorescent layer 3 is formed at the stage of wafer, the increase of man-hour for forming the fluorescent layer 3 can be substantially ignored. |
