发明名称 BONDER
摘要 <p>PROBLEM TO BE SOLVED: To avoid thermal damages of a lead frame, etc., in a simple structure by lifting the lead frame on a heat block with a frame lifter, when the normal transport of the lead frame transport is not made. SOLUTION: A lead frame 1 stops from transporting, a working rod of a cylinder 45 draws back to rotate counterclockwise a swing arm 42, a bearing holder 30, and a frame-returning arm 33 owing to springs 44 with center at a feed pin drive shaft 25, thereby pressing a vacuum chuck nozzle 34 to the lead frame 1. A nozzle 34 begins the vacuum chucking motion to chuck the lead frame 1, while a frame retain spring 10 goes away from the lead frame 1. Then, the action rod of the cylinder 45 projects to depress a roller 43, thereby clockwise rotating the holder 30, arms 33, 42 with a center at the drive shaft 25 and lifting the lead frame about 1-2mm from the heat block 2.</p>
申请公布号 JPH10199920(A) 申请公布日期 1998.07.31
申请号 JP19970010757 申请日期 1997.01.04
申请人 SHINKAWA LTD 发明人 SHIMURA MASAYUKI;ARAI HISASHI;OGAWARA MASAKI
分类号 H01L21/60;B23K20/00;H01L21/50;H01L21/52;(IPC1-7):H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址