ELECTRONIC COMPONENT HOLDING FILM AND MANUFACTURING METHOD THEREOF,申请号JP19970017822-传众专利搜索

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发明名称	ELECTRONIC COMPONENT HOLDING FILM AND MANUFACTURING METHOD THEREOF
摘要
申请公布号	JPH10200231(A)	申请公布日期	1998.07.31
申请号	JP19970017822	申请日期	1997.01.15
申请人	OMRON CORP	发明人	KAWAI WAKAHIRO
分类号	H05K1/18;H01L21/60;H05K1/11;H05K1/16;H05K3/32;H05K3/36;(IPC1-7):H05K1/18	主分类号	H05K1/18
代理机构		代理人
主权项
地址

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