发明名称 Method of depositing a platinum film for capacitor electrode
摘要 <p>A platinum film, which is used as a bottom electrode for a capacitor in a DRAM cell or a non-volatile ferroelectric memory cell, is formed in two separate processes, wherein a first thickness platinum part thereof is deposited under an inert gas atmosphere, and the second thickness platinum part is deposited under an atmosphere containing oxygen, nitrogen and/or a mixture thereof as well as an inert gas. The platinum film is annealed under a vacuum atmosphere to remove the oxygen an/or nitrogen introduced during the deposition of the second thickness platinum part. The annealed platinum film prevents formation of an oxide on a functional intermediate film such as a diffusion barrier layer or an adhesion layer, which is provided below the bottom electrode of platinum film. &lt;IMAGE&gt; &lt;IMAGE&gt; &lt;IMAGE&gt; &lt;IMAGE&gt;</p>
申请公布号 EP0855738(A2) 申请公布日期 1998.07.29
申请号 EP19980400033 申请日期 1998.01.09
申请人 TONG YANG CEMENT CORPORATION 发明人 PARK, DONG YEON;LEE, DONG SU;WOO, HYUN JUNG;CHUN, DONG IL;YOON, EUI JUN
分类号 C23C14/14;C23C14/16;C23C14/58;H01L21/02;H01L21/285;H01L21/8242;H01L21/8246;H01L27/10;H01L27/105;H01L27/108;(IPC1-7):H01L21/320 主分类号 C23C14/14
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