| 摘要 |
PROBLEM TO BE SOLVED: To prevent bonding wires from being exposed to the surface of a package and to hardly generate a wire sweep, by a method wherein a semiconductor chip is resin-sealed without making the bonding wires exposed, and a mark is formed on the surface, which is closest to the bonding wires, of a resin. SOLUTION: In a semiconductor device provided with a semiconductor chip 2, leads 1, bonding wires 4 and a sealing resin 8, the resin 8 seals the wires 4 without making the wires 4 exposed to the outside and has the surface to come into contact with the outside. Moreover, a mark of either of a recessed shape and a projected shape is formed on the surface which is closest to the wires 4, of the resin 8. For example, a top force 5 of a molding metal mold is provided with a metal mold cavity movable part 7 having the pressing surface stamped with a mark and in a state that the movable part 7 is made to descend, the resin 8 is injected in all the regions within the metal mold, then, the movable part 7 is pulled up the refill the resin in the metal mold and a resin-sealing of the ship 2 is performed. |
