发明名称 |
EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD AND LAMINATED BOARD PRODUCED WITH THE USE OF THE SAME |
摘要 |
An epoxy resin composition for printed wiring boards which comprises as the essential components (a) an epoxy resin obtained by epoxidizing a condensation product of a phenol with hydroxybenzaldehyde, (b) a condensation product of bisphenol A with formaldehyde, (c) a flame retardant, and (d) a curing accelerator, and a laminate for printed wiring boards which has a low hygroscopicity, a high heat resistance, good high-temperature characteristics, a high resistance against electrolytic corrosion, a high resistance against color change due to heating, and a high Tg. |
申请公布号 |
EP0835892(A4) |
申请公布日期 |
1998.06.10 |
申请号 |
EP19960918862 |
申请日期 |
1996.06.20 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
ARATA, MICHITOSHI;SASE, SHIGEO;TAKANO, NOZOMU;FUKUDA, TOMIO |
分类号 |
C08G59/32;C08G59/50;C08L61/06;C08L61/10;C08L61/12;C08L63/00;C08L63/04;H01B3/40;H01L23/14;H05K1/03 |
主分类号 |
C08G59/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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