发明名称 POSITIVE PHOTORESIST COMPOSITION AND MULTILAYER RESIST MATERIAL USING THE SAME
摘要 PROBLEM TO BE SOLVED: To form a resist pattern satisfactory in residual film ratio even in the case of forming an extrafine pattern of half micron or below and excellent in development contrast, exposure allowance, focus-depth-width characteristic and cross-sectional shape by adding a specific halogenated sulfonic acid to an alkali soluble resin and a quinone azide group-containing compound. SOLUTION: The alkali soluble resin, the quinone azide group-containing compound and the specific halogenated sulfonic acid are added. That is, a positive photoresist composition constituted so as to contain the alkali soluble resin, the quinone azide group-containing compound and at least one kind of the halogenated sulfonic acid expressed by formula, R<1> -SO2 -X, is used. In the formula, R<1> represents an alkyl group, a substituted alkyl group, an alkenyl group, an aryl group or a substituted aryl group, X represents a halogen atom.
申请公布号 JPH10133368(A) 申请公布日期 1998.05.22
申请号 JP19960305873 申请日期 1996.10.31
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SAWANO ATSUSHI;MIZUTA JUNICHI;DOI KOSUKE;OBARA HIDEKATSU;NAKAYAMA TOSHIMASA
分类号 G03F7/004;G03F7/022;G03F7/023;G03F7/11;H01L21/027;(IPC1-7):G03F7/022 主分类号 G03F7/004
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