| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need for accurately adjusting the viscosity of a resin in a potting method, by placing a frame to surround a semiconductor chip on a substrate, dripping a liq. resin inside the frame, and cutting the resin and substrate along a semiconductor chip after hardening the resin. SOLUTION: Many semiconductor chips or bare chips 10 are mounted on a substrate 20' and adhered to the top surface of the substrate with adhesives 12. Electrodes or lands of both are connected by the wire bonding method. A liq. resin 15 is dripped by the potting method and stored in pot-like parts defined by the substrate 20' at the bottoms and frame 30 at the side walls. The resin liq. level rises to penetrate the resin 15 among the chips 10. The potting ends to harden the resin 15. The substrate 20' and resin 15 are divided to produce many semiconductor devices, thus mounting the semiconductor chips 10 at a high density on the substrate 20'. |
