| 摘要 |
PROBLEM TO BE SOLVED: To prevent bad influence on a component due to sudden combustion of an adhesive layer for holding the component, and to prevent the components from sticking each other due to contact thereof after treatments, when the treatments of baking for forming external electrodes of a chip-like electronic component and heat treatment such as baking of a raw chip, etc., are simultaneously carried out for a plurality of components. SOLUTION: A treating base 14 on which an adhesive layer is not formed is used. When chip-like electronic components 12 are transferred onto the base 14 from a holder 15 holding a plurality of chip-like electronic components 12 in a spaced state, a spacer 20 provided with cavities 19 for individually receiving respective components 12 is used, and the components 12 are dropped form the holder 15 into respective cavities 19 in a state wherein this spacer 20 is sandwiched between the holder 15 and the base 14. Then, after the holder 16 and the spacer 20 are separated form the base 14, the component 12 is subjected to treatment such as heat treatment, etc., while it is placed on the base 14. |
