首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
VAPOR COOLING EQUIPMENT FOR SEMICONDUCTOR ELEMENT
摘要
申请公布号
JPH10116947(A)
申请公布日期
1998.05.06
申请号
JP19960270696
申请日期
1996.10.14
申请人
TOSHIBA CORP
发明人
OBE TOSHIHARU;SAITO IKUO
分类号
H01L23/427;(IPC1-7):H01L23/427
主分类号
H01L23/427
代理机构
代理人
主权项
地址
您可能感兴趣的专利
METHOD FOR SUPPLYING EDUCATION BY THREE-DIMENSIONAL CYBER CHARACTERS, VIRTUAL STUDY SPACES, AND REAL-TIME VOICES ON INTERNET
SYSTEM FOR SUPPLYING MOVING PICTURE ALBUM VIA INTERNET
METHOD FOR SERVICE OF STOCK INVESTMENT USING INTERNET
METHOD FOR MANAGING KYE COMMUNITY USING INTERNET
SOIL-SOLIDIFYING AGENT
TREAD RUBBER COMPOSITION
PREPARATION OF SYNTACTIC FOAM
FOAMED STYRENE RESIN SHEET
DAMAGE RESTORING COMPOSITE MATERIAL AND USE THEREOF
FIBER-REINFORCED SYNTHETIC RESIN LINEAR MATERIAL
PRODUCTION OF RESIN MOLDING
MOLDING TOOL STRUCTURE AND ITS MOLDED ARTICLE STRUCTURE
PRODUCTION EQUIPMENT FOR THERMOSETTING SYNTHETIC RESIN MOLDING MATERIAL
PAPER BASE MATERIAL LAMINATED SHEET AND MANUFACTURE THEREOF
PRODUCTION OF RADICICOL
FILM FITTED WITH HARD COAT, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE USING FILM FITTED WITH HARD COAT OBTAINED BY THE METHOD
DIE-ATTACHING PASTE
COLOR PRINTER HAVING VERTICALLY ARRANGED HEAD, METHOD FOR PRINTING AND PRINT HEAD THEREFOR
CRUSHER
EXHAUST PIPE STRUCTURE OF VEHICLE