发明名称 |
Ohmic electrode, its fabrication method and semiconductor device |
摘要 |
An ohmic electrode for III-V compound semiconductors such as GaAs semiconductors is provided to have satisfactory practical characteristics. Provided on an n+-type GaAs substrate is an ohmic electrode in which an n++-type regrown GaAs layer regrown from the n+-type GaAs substrate and a NiGe film containing particles of a precipitate composed of alpha '-AuGa are sequentially stacked. The ohmic electrode may be fabricated by sequentially stacking a Ni film, Au film and Ge film on the n+-type GaAs substrate, then patterning these films by, for example, lift-off, and thereafter annealing the structure at a temperature of 400 DIFFERENCE 750 DEG C. for several seconds to several minutes.
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申请公布号 |
US5747878(A) |
申请公布日期 |
1998.05.05 |
申请号 |
US19970822060 |
申请日期 |
1997.03.24 |
申请人 |
SONY CORPORATION |
发明人 |
MURAKAMI, MASANORI;OKU, TAKEO;OTSUKI, AKIRA |
分类号 |
H01L21/28;H01L21/285;H01L29/45;(IPC1-7):H01L23/48;H01L23/52 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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