发明名称 Ohmic electrode, its fabrication method and semiconductor device
摘要 An ohmic electrode for III-V compound semiconductors such as GaAs semiconductors is provided to have satisfactory practical characteristics. Provided on an n+-type GaAs substrate is an ohmic electrode in which an n++-type regrown GaAs layer regrown from the n+-type GaAs substrate and a NiGe film containing particles of a precipitate composed of alpha '-AuGa are sequentially stacked. The ohmic electrode may be fabricated by sequentially stacking a Ni film, Au film and Ge film on the n+-type GaAs substrate, then patterning these films by, for example, lift-off, and thereafter annealing the structure at a temperature of 400 DIFFERENCE 750 DEG C. for several seconds to several minutes.
申请公布号 US5747878(A) 申请公布日期 1998.05.05
申请号 US19970822060 申请日期 1997.03.24
申请人 SONY CORPORATION 发明人 MURAKAMI, MASANORI;OKU, TAKEO;OTSUKI, AKIRA
分类号 H01L21/28;H01L21/285;H01L29/45;(IPC1-7):H01L23/48;H01L23/52 主分类号 H01L21/28
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