| 摘要 |
PURPOSE:To prevent corrosion of chips and bonding wires attributable to ions by a method wherein an ion-absorbing agent is mixed with a gelatinized sealing compound in a semiconductor device to be sealed up by said gelatinized sealing compound. CONSTITUTION:An ion-absorbing agent composed of material with a high ion- absorbing capability is mixed with a gelatinized sealing compound 5 in a semiconductor device to be sealed up with a gelatinized plastic compound. The ion- absorbing agent may be molecular sieves, activated carbon, porous alumina or the like that absorbs ions mechanically or a chelate such as ethylenediaminetetroacetate, nitrilotriacetate or the like that absorbs ions chemically. The ion- absorbing agent arrests metallic or halogenous ions coming into the gelatinized sealing compound 5, thereby greatly improving semiconductor device reliability. |
