| 摘要 |
<p>PROBLEM TO BE SOLVED: To relieve the thermal stress to a connecting section and, at the same time, to increase the adhesion between a sealing resin and a semiconductor chip. SOLUTION: Au bumps 3 and solder bumps 6 are respectively formed on chip electrodes 2 on a semiconductor chip 1 and board electrodes 5 on a wiring board 4. The bumps 3 and 6 are joined to each other. The space between the chip 1 and board 4 is filled up with a sealing resin 7 and the resin 7 is cured. When the resin 7 is cured, a base resin layer 9 composed only of the base resin of the sealing resin 7 is formed on the chip 1 side and a mixed layer 10 of the base resin and a filler is formed on the board 4 side.</p> |
