发明名称 |
PREPREG FOR PRINTED WIRING BOARDS, RESIN VARNISH, RESIN COMPOSITION, AND LAMINATE FOR PRINTED WIRING BOARDS PRODUCED BY USING THESE SUBSTANCES |
摘要 |
<p>Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution. <IMAGE></p> |
申请公布号 |
EP0837090(A1) |
申请公布日期 |
1998.04.22 |
申请号 |
EP19960918863 |
申请日期 |
1996.06.20 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
TAKANO, NOZOMU;SASE, SHIGEO;FUKUDA, TOMIO;ARATA, MICHITOSHI |
分类号 |
B32B27/04;C03C25/40;C08J5/06;C08J5/08;C08J5/24;H05K1/03;(IPC1-7):C08J5/24;B32B15/08;C08L83/04;C08G77/04;D06M15/643 |
主分类号 |
B32B27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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