| 摘要 |
<p>PURPOSE:To enable simultaneous measurement even if IC chips are extremely rectangular by disposing the electrodes for test in wafer condition at least at three sides each of the rectangles, and arranging these chips side by side so that they may be opposed to each other on the sides, where the electrodes of semiconductor devices are not disposed. CONSTITUTION:Electrode pads 4 and electrode pads 5 for wafer test are arranged on an IC chip 1, and electrode pads 6 and electrode pads 7 for wafer test are arranged on an IC chip 2, and a probe needle 8 contacts with the electrode pads 5 and the electrode pads 7, whereby an external tester are electrically connected to the IC chips 1 and 2. That is, pads for wafer test are arranged on the three sides each excluding the sides of plural chips which are to be measured at the same time, and the orientations of 0 deg. and 180 deg. in chip arrangement are alternated. Thus, two chips can be regarded to be equivalent to one conventional chip, and simultaneous measurement of plural chips can be carried out.</p> |
