ELEMENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a thin element embedded printed circuit board with a reduced thickness, and a method of manufacturing the same.SOLUTION: An element embedded printed circuit board 100 includes: a substrate including a first circuit layer 20 formed on one surface of an insulation layer 40, and a second circuit layer 30 formed on another surface; and an element 90 including an electrode part and embedded in the insulation layer 40 of the substrate. The electrode part of the element 90 is in contact with the first circuit layer 20.SELECTED DRAWING: Figure 1