发明名称 |
PROCESS FOR MANUFACTURING TRANSPARENT CONDUCTIVE FILM WIRIVG BOARD |
摘要 |
<p>A process for manufacturing a transparent conductive film wiring board capable of being practiced according to a dry procedure to simplify the manufacturing and reduce the manufacturing costs. First, a SiO2 layer is provided on a substrate and then a black ITO film is formed on the SiO2 layer. The black ITO film is subject to processing using laser emitted from an output horn, resulting in being cut into a predetermined wiring pattern. Metal evaporated by laser processing is sucked by a vacuum suction head. Then, the substrate is subject to calcination to oxidize and crystallize the black ITO film 3 of the wiring pattern to form a transparent ITO film of the wiring pattern.</p> |
申请公布号 |
KR0128687(B1) |
申请公布日期 |
1998.04.15 |
申请号 |
KR19930006973 |
申请日期 |
1993.04.26 |
申请人 |
FUTABA DENSHI KOGYO KK. |
发明人 |
OGAWA, YUKIO;YAMAURA, TATSUO;MAMIKAWA, MAMORU;INOUE, AKIRA |
分类号 |
B23K26/00;G02F1/1343;H01B13/00;H01J17/04;H05K1/03;H05K3/02;H05K3/08;(IPC1-7):H01B13/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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