| 摘要 |
PROBLEM TO BE SOLVED: To realize a semiconductor manufacturing device, which is enhanced in capacity for processing a wafer by a method, wherein the semiconductor manufacturing device is composed of a control means which has previously transferred a wafer to an exposure system from a first outer device and another control means which transfers a following wafer to the exposure system from the first outer device. SOLUTION: When a start command is given to an exposure system 403 from a host computer 401 (S603), a wafer is transferred to an exposure stage (S604). An exposure process is started (S605), and a next lot wafer sending command is given to a C/D 402 from the host computer 401 (S606). By this setup, the wafer of a following lot is transferred to the exposure system 403 (S607), and an exposure process is finished. After exposure has been finished, a start command for wafers of a following lot is given to the exposure system 403 from the host computer 401 (S609). By this setup, a wafer of the next lot is transferred to an exposure stage (S610). |
