| 摘要 |
PROBLEM TO BE SOLVED: To surely attach/detach a polishing pad to/from the surface of a platen by providing a surface for receiving a polishing pad, a rotatable platen having a path penetrating through the platen to the surface, and a pump for exhausting air from the path. SOLUTION: When a computer opens a valve 204, a vacuum pump 200 feeds a suction force to a pad chuck chamber via fluid pipes 202, 206, 209 and an axial path 210. The pad chuck chamber distributes its suction pressure to respective radial paths 220 and secondly, the respective paths feed the suction pressure to a recessed part 226. The recessed part 226 distributes the suction pressure between holes 232 and these holes feed the suction pressure to the polishing pad 32. The relatively uniform differential pressure which is generated across the polishing pad 32 generates a net downward pressure for holding the polishing pad 32 on a platen assembly 30. |
