发明名称 Systems for testing and packaging integraged circuits
摘要 Several embodiments of stress metal springs are disclosed, which typically comprise a plurality of stress metal layers that are established on a substrate, which are then controllably patterned and partially released from the substrate. An effective rotation angle is typically created in the formed stress metal springs, defining a looped spring structure. The formed springs provide high pitch compliant electrical contacts for a wide variety of interconnection systems, including chip scale semiconductor packages, high density interposer connectors, and probe contactors. Several embodiments of massively parallel interface integrated circuit test assemblies are also disclosed, comprising one or more substrates having stress metal spring contacts, to establish connections between one or more separated integrated circuits on a compliant wafer carrier.
申请公布号 AU6863001(A) 申请公布日期 2002.01.02
申请号 AU20010068630 申请日期 2001.06.20
申请人 NANONEXUS, INC. 发明人 SAMMY MOK;FU CHIUNG CHONG
分类号 G01R31/26;G01R1/067;G01R1/073;H01L21/66;H01L23/12;H01L23/31;H01L23/32;H01L23/48;H01L23/485 主分类号 G01R31/26
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