| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor mounting substrate and manufacturing method thereof which has semiconductor mounting parts with out dirt and superior advantage in adhesion between the base and heat sink. SOLUTION: A base 2 of the semiconductor mounting substrate 21 has hole 5 at semiconductor mounting parts, and a heat sink 3 is bonded to a heat sink bonding plane of the base 2 through adhesives 4. The heat sink 3 has protrusions 22 having nearly equal sizes to that of the hole 5, and equal heights an steps 23 formed at the edges of the holes 5 on the heat sink bonding plane, so that the protrusions 22 about on the heads of the steps 23.</p> |
