Cooler apparatus for e.g. semiconductor assembly module of personal computer

摘要

The heat generated by the circuit elements (33) is converted by a coolant (41), while its coupled thermally to the circuit elements by conductors (35). Provided with the conductors are a preset number of first conductive elements (38), each in an appropriate aperture (37) in the respective conductor. The conductive elements are movably held in the aperture in the conductor by conductive material (35) between the side faces of the first conductive element and a face of each aperture. Pref. a second conductive material (40) is located between the first conductive element and the circuit element.