Multilayer circuit board and photosensitive resin composition usable therefor

摘要

A multilayer circuit board with blind via-holes (5) having a resolution in the range of 25 SIMILAR 80 mu m and an aspect ratio in the range of 2.0 SIMILAR 0.6 for contacting the layers to each other thereby, wherein an insulating layer (1, 2) between said layers having the blind via-holes (5) has a glass transition temperature in the range of 150 SIMILAR 220 DEG C, and an epoxy group photosensitive resin composition being used therefor. A photosensitive resin composition having preferable resolution and heat resistance was found. A multilayer circuit board, of which thermal stress generated in the steps of a reflow process, a gold wire bonding process, and a repairing process in a bare chip mounting process, and peeling off the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses at the heating processes were suppressed, was obtained. Accordingly, decreasing size and weight of electronic apparatus became possible.