| 摘要 |
A package arrangement (10) is disclosed which utilizes a multi-layer ceramic (MLC) component subassembly member (14) which extends beyond the periphery of the package sidewalls. The MLC member contains a number of bondpad sites formed on its inner layers to provide for the connection of leads (18) to the package, where the leads do not have to penetrate the package sidewalls. This aspect of the package thus provides improved hermeticity over prior art designs. A metallic base plate (12) is attached to the underside of the MLC and is electrically connected to metallic sidewalls to provide EMI and mechanical protection. The package may be utilized for housing either electronic or optoelectronic components. |
