发明名称 |
Device for interconnecting integrated circuit packages to circuit boards |
摘要 |
A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted on the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.
|
申请公布号 |
USRE35733(E) |
申请公布日期 |
1998.02.17 |
申请号 |
US19940353500 |
申请日期 |
1994.12.09 |
申请人 |
CIRCUIT COMPONENTS INCORPORATED |
发明人 |
HERNANDEZ, JORGE M.;SIMPSON, SCOTT S.;HYSLOP, MICHAEL S. |
分类号 |
H05K1/02;H05K3/32;H05K7/10;H05K7/20;(IPC1-7):H05K7/00 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|