| 摘要 |
<p>PROBLEM TO BE SOLVED: To manufacture a high quality IC card at low manufacturing cost. SOLUTION: In a card main body 1, i.e., an integrated circuit card having a integrated circuit 2 fixed within a cavity of the card main body and a conductive polymer spread over the surface of the card main body and connected to the integrated circuit, a portion of the integrated circuit 2 and card main body being in the proximity of, at least, the integrated circuit is covered with a resin layer 4. The integrated circuit has a thickness of 120μm or lower, and is located near the substantial center of the card underneath the resin layer 4.</p> |
