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发明名称
REFLOW SOLDERING EQUIPMENT
摘要
申请公布号
JPH1041619(A)
申请公布日期
1998.02.13
申请号
JP19960208807
申请日期
1996.07.19
申请人
SONY CORP
发明人
ENDO MASARU
分类号
H05K3/34;(IPC1-7):H05K3/34
主分类号
H05K3/34
代理机构
代理人
主权项
地址
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