| 摘要 |
<p>PROBLEM TO BE SOLVED: To bury a device in a board by making a through-hole in a printed board A, forming a pattern on one surface thereof, plating copper on one surface of a printed board B, carrying out spot facing on the other surface thereof corresponding to the outer circumferential part of a recessed part, bonding the patterned surface of the board A and the adhesive sheet surface of the board B together, and laminating both boards together. SOLUTION: A hole is made in a board 1 (board A) and copper plating treatment is carried out to provide a through-hole, and a wiring pattern 4 is formed on one surface thereof. Copper plating 2 is performed on one surface of a board 6 (board B), a groove-shaped spot facing part 7 is provided on the opposite surface thereof so as to correspond to a recessed part, an adhesive sheet 8 is pre-bonded on the outside of the part 7, and the boards 1, 6 are bonded together with the sheet 8 facing them. Spot facing is performed from the surface of the board 6 opposite to the spot facing part 7, the part without the sheet is removed to make a recessed part in the multilayer board, electroless plating 15 is carried out, and an SMT pattern is formed for a chip component by external form processing. An IC chip 20 can be mounted by flip-chip bonding in this recessed part, and an IC bare chip can be buried in the board.</p> |
