摘要 |
<p>Cards made from any one of the following thermoplastic resin compositions (I to III), having an excellent balance among heat resistance, moldability, and embossability, and hence utilizable in magnetic cards, IC cards and the like. (I) A composition comprising a blend of the following components (A and B). (II) A composition comprising a blend of the following components (A, B and D). (III) A composition comprising a blend of at least one member selected from among the components (A, B and D) with the component (C), the content of the component (C) being 2 to 25 parts by weight based on 100 parts by weight in total of the components (A, B and D). In the compositions (I) to (III), the component (A) is a polyester comprising dicarboxylic acid units composed mainly of terephthalic acid units and glycol units composed mainly of ethylene glycol units (I) and 1,4-cyclohexanedimethanol units (II), and the molar ratio of the ethylene glycol units (I) to the 1,4-cyclohexanedimethanol units (II) is not less than 1; the component (B) is an aromatic polycarbonate; the component (C) is an organic flaky filler having an average particle diameter of 0.5 to 20 νm; and the component (D) is a polyester comprising dicarboxylic acid units composed mainly of terephthalic acid units and glycol units composed mainly of ethylene glycol units (I) and 1,4-cyclohexanedimethanol units (II), and the molar ratio of the ethylene glycol units (I) to the 1,4-cyclohexanedimethanol units (II) is less than 1.</p> |