| 摘要 |
PROBLEM TO BE SOLVED: To provide the piezoelectric vibrator of a desired form with satisfactory reproducibility by arranging the piezoelectric vibrator on one face of a substrate, arranging a piezoelectric vibrator driving circuit on the other face, forming the lower electrode of the piezoelectric vibrator on the bottom of a hole part and providing a wiring electrode an the inclined part of the hole part. SOLUTION: The piezoelectric vibrator 2 and the driving circuit 3 are provided on the opposite sides of the substrate 1. Thus, the piezoelectric vibrator of several ten to hundreds μm is formed and it is heat treated at more than 500 deg.C. Then, the wiring electrode of the driving circuit can be formed by using a semiconductor forming process. Then, only a driving circuit forming face-side is exposed to foaming gas at the time of a foaming gas processing and gas is prevented from entering a piezoelectric vibrator forming-side on an opposite side by providing the piezoelectric vibrator 2 and a driving circuit area 3 on the opposite sides of the substrate 1. The lower electrode 23a of the piezoelectric vibrator 2 is formed at the bottom of the hole 6 and the wiring electrode is provided on the inclined part of the hole part 6. Thus, the piezoelectric vibrator 2 in the desired form can be formed with satisfactory reproducibility. |
