RADIATION IMAGE PICKUP DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain a radiation image sensor which can be manufactured at a low cost without using a tapered fiber and produce a picture without missing and deformation and with high S/N ratio. SOLUTION: This sensor is provided with a photodiode array chip 11 arranged in matrix which is provided with a light reception part 23 arranged in matrix in which a light reception element is formed of a set of photodiode and switch element and an electrode pad part 44 on the outer periphery. Wiring plates 13a and 13b are placed vertically between adjoining photodiode array chips 11. The light reception element is successively selected one by one in the lower part of the plate 13a, and a vertical shift register chip 14 is provided to output a signal. A charge amplification array chip 15 is provided in the lower part of the plate 13b so as to process the signal from the selected light reception elements.