| 摘要 |
PROBLEM TO BE SOLVED: To provide good heat dissipation effect and improved reliability and economy by encapsulating a lead frame, a radiating plate, a semiconductor chip, and a bonding wire with resin. SOLUTION: A hole is provided in the central part of a tab of a lead frame 2. A heat dissipating plate 6 is fitted into the hole and a semiconductor chip 7 is mounted on the upper surface of the heat dissipating plate 6. Further, a bonding wire 8 connects a bonding pad formed on the semiconductor chip 7 to an inner lead 4 of the lead frame 2 extending to the vicinity of that bonding pad. Then, the lead frame 2, the heat dissipating plate 6, the semiconductor chip 7, and the bonding wire 8 are encapsulated with resin. Thus, the semiconductor chip 7 can be mounted directly on the upper surface of the heat dissipating plate 6 so that improved heat dissipating effect can be obtained as compared with the structure in which heat is dissipated via a tab. |
