| 摘要 |
<p>An enclosure (10) provided with an air supply system (54, 55), an exhaust system (50, 51), and controls (36) for manipulating the flow, temperature, dewpoint and relative humidity of the air within the enclosure (10) are disclosed. The present invention aims to achieve with these components a system for containing chemical contaminants created during processing of silicon wafers during the chemical/mechanical, polishing/planarization processes involved in creating those wafers. The system prevents drying of the slurry used to process wafers by controlling the relative humidity within the enclosure via a humidifier (33), sensors (60, 61, 62) and a controller (36) that dynamically reacts to changes within the enclosure atmosphere. Additionally, air supply within the enclosure (10) is controlled in order to further reduce slurry drying. Enclosures operated in accordance with the present invention preferably also prevent ambient contamination of the process area surrounded by the enclosure via physical (14) or air flow (13) barriers.</p> |
