| 发明名称 |
Ultrasonically activated solder bath apparatus |
| 摘要 |
<p>A support portion (14a) for attaching a horn main body (14) to a solder tank (1) is provided on the horn main body at a nodal point and ultrasonic vibration from an external transducer (13) is transmitted to solder in the solder tank through the horn main body. <IMAGE></p> |
| 申请公布号 |
EP0816000(A1) |
申请公布日期 |
1998.01.07 |
| 申请号 |
EP19970106461 |
申请日期 |
1997.04.18 |
| 申请人 |
ULTEX CORPORATION |
发明人 |
SATO, SHIGERU;KATSUMI, MITSUGU;ISHII, RYOICHI |
| 分类号 |
B23K1/08;B06B1/02;B23K3/06;(IPC1-7):B23K3/06 |
主分类号 |
B23K1/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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