发明名称 |
Electroless plating of a metal layer on an activated substrate |
摘要 |
A method of electroless plating at least one homogeneous metal coating in a predetermined pattern on a solid substrate surface having pendant hydroxy groups. The method includes the steps of providing a first monatomic metal layer in a predetermined pattern on the solid substrate surface having pendent hydroxy groups and then immersing the solid substrate surface in a bath containing a chemical reducing agent to build up the at least one homogeneous metal coating only on the monatomic metal layer. |
申请公布号 |
AU3221197(A) |
申请公布日期 |
1998.01.05 |
申请号 |
AU19970032211 |
申请日期 |
1997.05.30 |
申请人 |
THE UNIVERSITY OF TOLEDO |
发明人 |
JAMES L. FRY;STEPHEN UHLENBROCK;RITA KLEIN |
分类号 |
C23C18/16;C23C18/30 |
主分类号 |
C23C18/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|