发明名称 Electroless plating of a metal layer on an activated substrate
摘要 A method of electroless plating at least one homogeneous metal coating in a predetermined pattern on a solid substrate surface having pendant hydroxy groups. The method includes the steps of providing a first monatomic metal layer in a predetermined pattern on the solid substrate surface having pendent hydroxy groups and then immersing the solid substrate surface in a bath containing a chemical reducing agent to build up the at least one homogeneous metal coating only on the monatomic metal layer.
申请公布号 AU3221197(A) 申请公布日期 1998.01.05
申请号 AU19970032211 申请日期 1997.05.30
申请人 THE UNIVERSITY OF TOLEDO 发明人 JAMES L. FRY;STEPHEN UHLENBROCK;RITA KLEIN
分类号 C23C18/16;C23C18/30 主分类号 C23C18/16
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