| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of chips, breaks and cracks in insulation boards even when wiring boards comprising them collide violently with each other or the wiring board collides violently with some portion of a semiconductor device manufacturing line, by forming each insulation board through binding inorganic insulation powder with a thermosetting resin having an excellent toughness. SOLUTION: This wiring board comprises insulation boards 1a-1c made of 60-95wt.% inorganic powder bound with a 5-40wt.% thermosetting resin on one-principal surfaces of at least one board of which wiring conductors 2 made of metallic powder bound with a thermosetting resin are stuck. In this case, the grains of the inorganic insulation powder contained in the insulation boards 1a-1c are so bound with the thermosetting resin that the sizes of the grains distributed on the surface sides of the insulation boards 1a-1c whereon the wiring conductors 2 are stuck are made smaller than the sizes of the grains distributed on the opposite surface sides thereto. |
